GaAs Millimeter Wave/Sub-Millimeter Wave Schottky Diodes
Products and Services
Teledyne Scientific Company offers a wide variety of millimeter-wave and submillimeter-wave planar airbridged Schottky diodes for applications in the 10 GHz to over 2.5 THz range.

Unique Diode Properties
  • Junction capacitance as low as 2fF allowing cutoff frequency >2THz
  • Very low parasitic capacitance < 9fF
  • Ultra low series resistance < 3Ω
  • Airbridged anode contact for low parasitic operation
  • Fully passivated by SiN
  • Flip chip and beamlead geometry
  • Space qualifiable construction
  • MMIC backend process available for integrated passives and vias
  • Unique gold stand-off platforms for ruggedness in flip-chip applications

GaAs Schottky Diode Products:

GaAs Millimeter Wave/Sub-Millimeter Wave Schottky Diodes.
Part Number (PDF) VF@ 1mA (mV) CJunction CTotal VR @ -5uA Geometry Chip Dimension (GaAs only)
TSC-S-01020 730-950 1.1 fF 18 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-S-0202 730-850 4.3 fF 23 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-S-03020 730-850 9.8 fF 30 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-S-04020 650-800 17 fF 40 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-SB-01020 730-950 1.1 fF 18 fF -5V min Beamlead 14 mil x 5.1 mil
TSC-SB-02020 700-850 4.3 fF 23 fF -5V min Beamlead 14 mil x 5.1 mil
TSC-SB-03020 700-850 9.8 fF 30 fF -5V min Beamlead 14 mil x 5.1 mil
TSC-SB-04020 650.800 17 fF 40 fF -5V min Beamlead 14 mil x 5.1 mil
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension (GaAs only)
TSC-AP-02020 700-850 4.3 fF 23 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-AP-03020 700-850 9.8 fF 30 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-AP-04020 650.800 17 fF 40 fF -5V min FlipChip 14 mil x 5.1 mil
TSC-APB-02020 700-850 4.3 fF 23 fF -5V min Beamlead 14 mil x 5.1 mil
TSC-APB-03020 700-850 9.8 fF 30 fF -5V min Beamlead 14 mil x 5.1 mil
TSC-APB-04020 650-800 17 fF 40 fF -5V min Beamlead 14 mil x 5.1 mil
* Single Junction
** Single Capacitance

TEE

Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-T-01025 730-950 1.1 fF 18 fF -5V min FlipChip 22.2 mil x 5.1 mil
TSC-T-02025 700-850 4.3 fF 23 fF -5V min FlipChip 22.2 mil x 5.1 mil
* Single Junction
** Single Capacitance
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-IT-01025 730-950 1.1 fF 18 fF -5V min FlipChip 22.2 mil x 5.1 mil
TSC-IT-02025 700-850 4.3 fF 23 fF -5V min FlipChip 22.2 mil x 5.1 mil
* Single Junction
** Single Capacitance
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-SS-0112 730-950 1.1 fF 14 fF -5V min FlipChip-Single 5.1 mil x 3 mil
TSC-SAP-0109 700-850 1.1 fF 14 fF** -5V min FlipChip-Antiparrallel 5.1 mil x 3 mil
* Single Junction
** Single Capacitance
Part Number (PDF) VF@ 1mA (mV) CJunction* CTotal** VR @ -5uA Geometry Chip Dimension
TSC-SSS-05425 660-750 23 fF 64 fF -5V min FlipChip 11.3 mil x 11.3 mil
TSC-SSS-06225 660-750 30 fF 75 fF -5V min FlipChip 11.3 mil x 11.3 mil
TSC-SSS-07025 660-750 39 fF 87 fF -5V min FlipChip 11.3 mil x 11.3 mil
* Single Junction
** Single Capacitance